DA 409 Prepreg

Film Adhesive

DA 409 Film Adhesive

A modified epoxy film adhesive which cures at 250°F (121°C).

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DA 409 is a modified epoxy film adhesive which cures at 250°F (121°C).

DA 409 is a modified epoxy film adhesive which cures at 250°F (121°C). The adhesive, recommended for metal-to-metal bonds, bonding of composite and honeycomb structures, exceeds the requirements of MMM-A-132, Type 1, Class 3, MIL-A-25463, Type 1, Class 1 and 2, and ASTM-E-865. DA 409 can be supplied on woven or non-woven synthetic carriers.


Weight: 0.060, 0.085 and 0.090 lbs/ft2

Volatiles: Less than 1%

Separator: Release paper and poly film

Shelf Life: One year at 0°F in a sealed container

Six months at 40°F

Twenty days at 75°F

Standard Roll: 750 square feet at 50 inches wide

Other weights and widths up to 60 inches wide available


Product Carrier – Release Characteristics -Liner Color

Wide open knit Red Enhances bondline thickness control; good structural and handling properties during layup.

T Tight knit tricot Red Highest overall performance.

M Random mat Red Provides flow control in bondline.



0.085 psf DA 409 cured at 250°F for one hour at 30 psi pressure.

Tensile Strength Normal Temperature 75°F 5400 psi

10 minutes at 180°F 4516 psi

10 minutes at -67°F 5030 psi

Fatigue Strength 600 psi at107 cycles no failures

Mechanical Property Conditions Test Values

Creep Rupture 1600 psi at 75°F, 192 hours 0.000″ deformation

800 psi at 75°F, 192 hours less than 0.002″ deformation

DA409 Film Adhesive


Store material in a contaminate free container and store at O degrees F for extended storage. For shorter storage time requirements store at 40 degrees F, this enables quicker stabilization times.


Remove material from cold storage at least 20 hours prior to use to allow for stabilization at room temperature. Keep the material wrapped to prevent moisture from condensing on the adhesive. If details are cut and replaced into cold storage, shorter stabilization times may be used.

Be sure parts to be bonded have been thoroughly cleaned and dried before bonding. Cut stabilized adhesive to part size, remove the poly separator and apply to part. Remove paper separator and join parts together. Parts are now ready to be bonded, and may be cured in a press, autoclave, or vacuum bag in oven..


The adhesive can be removed from non-bonding areas with ketones or methylene chloride. Be sure to follow all Material Safety Data Sheet (MSDS)  guidelines for the solvent to be used.


This material contains epoxy resins and amines which may cause irritation to sensitive skin. Avoid contact with eyes or skin. If contact with skin occurs, wash as soon as possible with soap and water. If contact with eyes occurs, flush with water for 15 minutes. Do not handle or use this material until Material Safety Data Sheet has been read and understood. The user of this material is required to use the necessary protective equipment as directed by applicable state and federal laws when handling, curing, and grinding this material.


Information in this data sheet has been obtained under controlled laboratory conditions and is believed to be accurate. Properties listed are typical values and are not intended for use in preparing specifications. Actual values may vary. No warranty is expressed or implied for which APCM assumes legal responsibility. APCM cannot be responsible for misapplication or handling and use under conditions beyond its control and under no circumstances shall be liable for incidental or consequential damage resulting from handling or use of this material.

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