DA 408 modified epoxy film adhesive.

FILM ADHESIVE

DA 408 Film Adhesive

A modified epoxy film adhesive which cures at 200°F (93°C)

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DA 408 is a modified epoxy film adhesive.

DA 408 is a modified epoxy film adhesive which cures at 200°F (93°C). The adhesive, recommended for metal-to-metal bonds, bonding of composite and honeycomb structures, DA 408 modified epoxy film adhesive can be supplied on woven or non-woven synthetic carriers.

PHYSICAL PROPERTIES:

Weight: 0.030, 0.045 and 0.060 lbs/ft2

Volatiles: Less than 1%

Separator: Release paper and poly film

Shelf Life: One year at 0°F in a sealed container

Six months at 40°F

Twenty days at 75°F

Standard Roll: Customers Requirements

Other weights and widths up to 60 inches wide available

AVAILABLE CARRIERS:

Product Carrier Release Characteristics

Liner Color

DA 408 modified epoxy film adhesive wide open knit. White Enhances bondline thickness control; good structural and handling properties during layup.

M Random mat White Provides flow control in bondline.

MECHANICAL PROPERTIES:

0.060 psf with scrim DA 409 cured at 200°F for one hour at 30 psi pressure.

Tensile Strength Normal Temperature 75°F 4500 psi

10 minutes at 180°F 3816 psi

STORAGE:

Store DA 408 modified epoxy film adhesive in a contaminate free container and store at O degrees F for extended storage. For shorter storage time requirements store at 40 degrees F, this enables quicker stabilization times.

APPLICATION:

Remove material from cold storage at least 20 hours prior to use to allow for stabilization at room temperature. Keep the material wrapped to prevent moisture from condensing on the adhesive. If details are cut and replaced into cold storage, shorter stabilization times may be used.

Be sure parts to be bonded have been thoroughly cleaned and dried before bonding. Cut stabilized adhesive to part size, remove the poly separator and apply to part. Remove paper separator and join parts together. Parts are now ready to be bonded, and may be cured in a press, autoclave, or vacuum bag in oven..

CLEAN UP:

The adhesive can be removed from non-bonding areas with ketones or methylene chloride. Be sure to follow all Material Safety Data Sheet (MSDS) guidelines for the solvent to be used.

CAUTION:

This material contains epoxy resins and amines which may cause irritation to sensitive skin. Avoid contact with eyes or skin. If contact with skin occurs, wash as soon as possible with soap and water. If contact with eyes occurs, flush with water for 15 minutes. Do not handle or use this material until Material Safety Data Sheet has been read and understood. The user of this material is required to use the necessary protective equipment as directed by applicable state and federal laws when handling, curing, and grinding this material.

IMPORTANT NOTICE:

Information in this data sheet has been obtained under controlled laboratory conditions and is believed to be accurate. Properties listed are typical values and are not intended for use in preparing specifications. Actual values may vary. No warranty is expressed or implied for which APCM assumes legal responsibility. APCM cannot be responsible for misapplication or handling and use under conditions beyond its control and under no circumstances shall be liable for incidental or consequential damage resulting from handling or use of this material.

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